To provide a photographic device provided with a cooling mechanism having a cooling function only to suppress heat generation from an integrated circuit and semiconductor parts without causing unnecessarily large sizing of a body.
A circulation passage 1201 is installed at the rear face side of a substrate PCB on which a CCD solid state image sensor 120 which is a heat source is mounted. While filling water in the circulation passage 1201, the water is made to absorb the heat at a heat absorption position on the rear face side of the CCD solid state image sensor 120. The water which is increased in volume and becomes lighter since the temperature locally rose by absorbing the heat is elevated by convection action is made to reach a radiation position PA contacted with the inner wall face IW of the body, and made to radiate heat to the exterior at that position PA. Furthermore, the water is made circulated by guiding the cooled water to the circulation passage of the opposite side to the rear face side (symbol PA side) of the CCD solid state image sensor 120.
TOKIWA KENTARO
Yoshio Kosugi
Mikami Yui