Title:
PHOTOPOLYMER COMPOSITION
Document Type and Number:
Japanese Patent JPH03170554
Kind Code:
A
Abstract:
PURPOSE:To obtain a highly sensitive and highly heat-resistant photosensitive polyimide resin composition having good adhesion and low modulus by mixing a siliconediamine/polyamic acid copolymer with an arcylamide, a styryl compound and an oxazolone compound as essential components. CONSTITUTION:A photopolymer composition is formed by mixing a polyamic acid (A) copolymerized with 1-50wt.% silicone-diamine of formula I (wherein (n) is 1-50) with a photosensitizer (B) comprising an acrylamide of formula II (wherein R1 is H, CH3 or CH2H5; and R2 and R3 are each H, CH3, C2H5, CH2OH or C6H5), a sensitizer (C) comprising a styryl compound of formula III (wherein R4 is H, CH3, C2H5 or C6H5; and R5 is benzoxazoly or the like) and an initiator (D) comprising an oxazolone compound of formula IV (wherein R6 is substituted phenyl or substituted naphthyl or the like). The amounts of the components are such that 20-200 pts.wt. component B, 1-10 pts.wt. component C and 1-20 pts.wt. component D are used per 100 pts.wt. component A.
More Like This:
| JP2004163800 | PHOTOSENSITIVE RESIN COMPOSITION |
| JP4295566 | Method for producing phenol derivative |
Inventors:
TOKO AKIRA
SASHITA NOBUYUKI
TAKEUCHI ETSU
SASHITA NOBUYUKI
TAKEUCHI ETSU
Application Number:
JP30931289A
Publication Date:
July 24, 1991
Filing Date:
November 30, 1989
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/004; C08K5/17; C08K5/20; C08K5/353; C08L79/08; G03F7/027; G03F7/028; G03F7/038; G03F7/075; (IPC1-7): C08K5/17; C08K5/20; C08K5/353; C08L79/08; G03F7/004; G03F7/027; G03F7/028; G03F7/038; G03F7/075