Title:
PHOTORESIST AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2012063737
Kind Code:
A
Abstract:
To provide a photoresist which strengthens adhesion by enhancing chemical bonding with a circuit, and a method of manufacturing printed circuit board by forming a high-density fine circuit using this photoresist.
A photoresist 100 includes: a first photosensitive resin layer 101, and a second photosensitive resin layer 102 formed on the first photosensitive resin layer 101. The first photosensitive resin layer 101 contains photosensitive polymers having acid functional groups.
Inventors:
KIM HE-JIN
KIM GOIN-SIK
CHANG SHOP LIU
KIM GOIN-SIK
CHANG SHOP LIU
Application Number:
JP2011021512A
Publication Date:
March 29, 2012
Filing Date:
February 03, 2011
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
G03F7/095; G03F7/039; G03F7/09; G03F7/11; G03F7/20; H01L21/027
Domestic Patent References:
| JP2004067398A | 2004-03-04 | |||
| JP2007079315A | 2007-03-29 | |||
| JP2009025482A | 2009-02-05 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
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