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Title:
PHOTORESIST UNDERCOAT-FORMING MATERIAL AND PATTERNING PROCESS
Document Type and Number:
Japanese Patent JP2006053543
Kind Code:
A
Abstract:

To provide an undercoat-forming material which, optionally combined with an intermediate layer having an antireflective effect, has an absorption coefficient sufficient to provide an antireflective effect at a thickness of ≥200 nm, has a higher etching resistance than ordinary m-cresol novolac resin as demonstrated by slower etching rates with CF4/CHF3 and Cl2/BCl3 gases for substrate processing, and gives a good resist shape after patterning.

The undercoat-forming material comprises a polymer compound prepared by copolymerizing an indene and a compound having a hydroxyl or epoxy group and a polymerizable double bond.


Inventors:
Hatakeyama, Jun
Takeda, Takanobu
Application Number:
JP2005000201417
Publication Date:
February 23, 2006
Filing Date:
July 11, 2005
Export Citation:
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Assignee:
SHIN ETSU CHEM CO LTD
International Classes:
G03F7/11; C08F212/14; C08F232/08; C08F234/00; H01L21/027
Attorney, Agent or Firm:
小島 隆司
重松 沙織
小林 克成
石川 武史