To provide a photosensitive adhesive composition having a pattern forming property and having an excellent low-temperature thermo-compression bonding property, a high-temperature adhesive property (heat resistance) and moisture resistance reliability after pattern formation and also having an excellent low-temperature adhering property when formed in a film, to provide a film-like adhesive, an adhesive sheet, an adhesive pattern, semiconductor wafer provided with the adhesive, a semiconductor device and a method for manufacturing the semiconductor device using the composition.

The photosensitive adhesive composition contains (A) an alkali-soluble resin, (B) a radiation polymerizable compound, (C) a photoinitiator, (D) a heat radical generator whose 1-minute half-life temperature is 120C and (E) a thermosetting resin.