To provide a photo-sensitive adhesive composition superior in a pattern forming property by an alkaline developer and having sufficient re-adhesion after exposed, and to provide an adhesive film also superior in pattern forming property by an alkaline developer, having a sufficient re-adhesion after exposure and capable of adhering it to an adherend at a low temperature.
The photo-sensitive adhesive composition comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photo-initiator, in which (A) the alkali-soluble resin has a glass transition temperature of 150°C or lower, (B) the epoxy resin has (B1) a component with three or more functions and (B2) a liquid component of which a part or all may be also (B1) a component with three or more functions.
COPYRIGHT: (C)2010,JPO&INPIT
Takashi Kawamori
Mitsukura
Katogi Shigeki
JP2005206737A |
WO2007004569A1 |
Yoshinori Shimizu
Tomoya Furoshita