To provide a photosensitive composition that gives a high-performance cured film (solder resist pattern, permanent pattern) excellent in various characteristics such as heat resistance, moisture heat resistance, adhesiveness, low water absorption, mechanical characteristics and electric characteristics, to provide a photosensitive film using the above photosensitive composition, and to provide a method for forming a permanent pattern and a permanent pattern using the above photosensitive composition or the photosensitive film.
The photosensitive composition includes a binder, a polymerizable compound, a thermal crosslinking agent and a photopolymerization initiator, wherein the binder contains a predetermined compound obtained by introducing a photosensitive group and an acid group into an epoxy compound derived from a predetermined phenol compound. The photosensitive film uses the above photosensitive composition. The above photosensitive composition or the photosensitive film is used for the method for forming a permanent pattern and the permanent pattern.
ARIOKA DAISUKE
Yoshihiro Nagare
Naoko Matsuda
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