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Title:
PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE MATERIAL, PRODUCTION OF RELIEF PATTERN AND PRODUCTION OF POLYIMIDE PATTERN
Document Type and Number:
Japanese Patent JPH10228105
Kind Code:
A
Abstract:

To obtain a photosensitive compsn. having excellent photosensitive characteristics and storage stability, high resolution and good process stability by incorporating a resorcinol compd., a titanocene compd. and an addition polymerizable compd. having a specified or higher boiling point.

This compsn. contains a resorcinol compd. expressed by formula I, a titanocene compd. expressed by formula II and an addition polymerizable compd. having ≥100°C boiling point at normal pressure. Further, the compsn. contains a dye compd. having absorption in 450 to 600nm region. In the formula I, R1 to R4 are independently hydrogen atoms, 1 to 5C alkyl groups, phenyl groups, etc., or heterocyclic groups. In the formula II, R5 to R14 are independently hydrogen atoms, halogen atoms, 1 to 20C alkoxy groups or heterocyclic groups. Thereby, the obtd. photosensitive compsn. shows excellent photosensitive characteristics and storage stability, high resolution and good process stability.


Inventors:
KO MASAHIKO
KOJIMA YASUNORI
KAJI MAKOTO
Application Number:
JP3152597A
Publication Date:
August 25, 1998
Filing Date:
February 17, 1997
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/004; C08G73/10; G03F7/008; G03F7/027; G03F7/029; G03F7/038; G03F7/40; H01L21/027; H01L21/312; (IPC1-7): G03F7/029; C08G73/10; G03F7/004; G03F7/008; G03F7/027; G03F7/038; G03F7/40; H01L21/027; H01L21/312
Attorney, Agent or Firm:
Kunihiko Wakabayashi