To apply exposure with short wavelength ultraviolet rays or ionizing radiation or the like and to enhance dry etching resistance and to enlarge allowance in exposure and development with an aqueous solution of alkali and to enable a pattern good in the cross section form to be formed by incorporating an alkali-soluble polymer and an acid-decomposable compound and a compound to be allowed to generate an acid by irradiation with chemical radiation.
The photosensitive composition contains the alkali-soluble polymer having a softening point of ≥150°C and an average molecular weight of 3000-8000 and the compound decomposable by an acid and the compound to be allowed to generate an acid by irradiation with chemical radiation. The chemical radiation means the general term of energy radiation or substantial radiation giving chemical change to the photosensitive composition, for example, short wavelength ultraviolet rays, electron beams, and X rays, and the like. This photosensitive composition contains the 2 components of a dissolution inhibitor and an acid generator, and the dissolution inhibitor is decomposed by an acid generated from action of the acid generator by the exposure, and solubilized in an aqueous solution of alkali after the exposure.
YUASA FUMIHIKO
GOKOCHI TORU
TADA TSUKASA
SAITO SATOSHI
NAITO TAKUYA
SASAKI OSAMU
