PURPOSE: To enhance adhesion between a protective film and the sealing resin, heat resistance, and exposure sensitivity by specifying the structural units of the polyamide-imide and their contents.

CONSTITUTION: The photosensitive composition comprises the polyamide-imide comprising the structural units represented by formula I in an amount of 0.1 - 99.9mol% and the structural units represented by formula II, and a photosensitive agent. In formulae I and II, A is a divalent organic group having at least OH group; E is a divalent organic group; and G is a tetravalent organic group, thus permitting the obtained photosensitive composition to be superior in adhesion between the protective film made of an inorganic material formed on the surface of the semiconductor substrate and the sealing resin, and superior in heat resistance and further, exposure sensitivity and capable of forming a sharp relief pattern.