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Title:
PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2011075786
Kind Code:
A
Abstract:

To provide a photosensitive composition having sufficient light reflection performance, as well as, capable of obtaining a cured material superior in heat resistant crack and workability.

The photosensitive composition contains at least one component from among a polymerizable hydrocarbon monomer and a polymerizable hydrocarbon polymer, hollow particles and a photopolymerization initiator. Porosity of the hollow particles is 30-99 vol.%, and the average particle size of the hollow particles is 0.1-20 μm.


Inventors:
NAKAMURA HIDE
NISHIMURA TAKASHI
SHIKAGE TAKASHI
TAKAHASHI TOSHIO
WATANABE TAKASHI
INAOKA MIKI
OMURA TAKAHIRO
MAENAKA HIROSHI
Application Number:
JP2009226503A
Publication Date:
April 14, 2011
Filing Date:
September 30, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
G03F7/032; C08F2/44; C08F2/48; C08F290/00; C08F299/02
Attorney, Agent or Firm:
宮▲崎▼ 主税
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