Title:
PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2018169604
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition that gives a cured film having excellent transparency, heat resistance, surface smoothness, resolution, and chemical resistance without requiring an organic solvent of high polarity, a cured film formed of the photosensitive composition, and an electronic component having the cured film.SOLUTION: A photosensitive composition contains a polyester amide acid (A), a compound having a polymerizable double bond (B), a photopolymerization initiator (C), a polymer having an epoxy group with a weight average molecular weight of 3,000-50,000 (D), an epoxy compound that contains 2-10 epoxy groups per molecule, with a weight average molecular weight of less than 3,000 (E), an epoxy curing agent (F), and a molecular weight modifier (G).SELECTED DRAWING: None
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Inventors:
NARA KAZUMI
OKAMOTO YUKI
OKAMOTO YUKI
Application Number:
JP2018021299A
Publication Date:
November 01, 2018
Filing Date:
February 08, 2018
Export Citation:
Assignee:
JNC CORP
International Classes:
G03F7/037; C08F2/48; G02B5/20; G02F1/1333; G03F7/004; G03F7/027; G03F7/031; G03F7/032; G03F7/039; H01L33/56