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Title:
PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD USING THE SAME, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2009031344
Kind Code:
A
Abstract:

To provide a photosensitive dry film resist, a manufacturing method therefor, and usage of it, which enables aqueous development and has superior resolution, flame retardancy, adhesion, moisture resistance, electrical reliability, sensitivity, and ease of handling.

The photosensitive dry film resist has two or more layers including at least a first photosensitive layer and a second photosensitive layer. The first photosensitive layer contains a binder polymer, a (meth)acrylic compound, a photoreaction initiator, and a flame retardant as essential components. The second photosensitive layer contains a binder polymer, a (meth)acrylic compound, a dye, and/or a pigment as essential constituents. The second photosensitive layer substantially does not contain flame retardants, and contents of the dye and/or the pigment in the second photosensitive layer are higher than those of the first photosensitive layer.


Inventors:
YAMANAKA TOSHIO
OKADA YOSHIFUMI
NOJIRI HITOSHI
Application Number:
JP2007192194A
Publication Date:
February 12, 2009
Filing Date:
July 24, 2007
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
G03F7/004; C08F2/44; C08F283/04; C08F291/00; G03F7/031; G03F7/033; G03F7/037; H05K3/28
Attorney, Agent or Firm:
Kenzo Hara International Patent Office