To provide an ArF photosensitive film resin which does not dissolve in a developing solution easily as well as having an etching resistance, a heat resistance and an adhesive power, and to provide a production method of the same, further, to provide a copolymer used for this new ArF photosensitive film resin, a production method of the copolymer, and also the photosensitive film containing the ArF photosensitive film resin and a production method of the photosensitive film, and to provide a semiconductor device produced by applying the photoresist containing the ArF photosensitive film resin and a production method of the semiconductor device.
The copolymer is a new photoresist substance capable of using in a far-ultraviolet region, is a copolymer of 3,000-100,000 molecular weight which is produced by copolymerizing a bicycloalkene derivate and maleic anhydride or vinylene carbonate, and has not only an excellent etching resistance, heat resistance and adhesive property, but also can develop by using the TMAH solution as the development solution.
BOK CHEOL KYU
BAIK KI HO
