To provide a photosensitive film, including a cured film exhibiting less gloss and preventing misrecognition by an AOI inspection machine, having high sensitivity, and excelling in plating properties, bending properties, heat resistance and tackiness.

In the photosensitive film, a layer of a photosensitive resin composition is formed on a semitransparent support film; the photosensitive resin composition comprises (A) a compound obtained, by making an epoxy acrylate compound having an ethylenically unsaturated group and two or more hydroxyl groups, a diisocyanate compound, and a diol compound having a carboxyl group react; (B) a binder polymer having a carboxyl group; (C) a black pigment; (D) an urethane-unsaturated oligomer; (E) a photopolymerizable compound; (F) a photopolymerization initiator; and (G) a heat-curing agent.