To provide a photosensitive film for a mask, which can be easily stripped without leaving a residue even when the mask has a narrow pitch or after the mask is subjected to a high-temperature reflow process or a plating process using a strong chemical solution.

The photosensitive film includes a support film, a photosensitive resin layer disposed on the support film, a release layer disposed on the photosensitive resin layer, and a protective film disposed on the release layer. The photosensitive resin layer is formed of a photosensitive resin composition comprising (A) a resin containing a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group, and (C) a photopolymerization initiator. The release layer is formed of an alkali-soluble resin composition comprising (D) a resin having a carboxyl group and/or a hydroxyl group. The viscosity of the release layer at 50 to 100°C is lower than the viscosity of the photosensitive resin layer at 50 to 100°C.