感光性絶縁膜形成組成物

Japanese Patent JP7444239

B2

Provided are: a photosensitive insulating film composition that gives a cured body for which the initial dielectric tangent is low and changes over time therein are small; a method for producing a cured relief pattern-equipped substrate using the photosensitive insulating film composition; and a semiconductor device provided with the cured relief pattern. A photosensitive insulating film-forming composition containing a polymer having a repeating unit structure represented by formula (1): [in formula (1), group A1 represents an aromatic heterocycle represented by (A1); group A2 represents an aromatic heterocycle represented by (A2); group A1 and group A2 may have crosslinkable substituents; group B1 represents an organic group having a crosslinkable substituent; and group B2 represents an organic group not having a crosslinkable substituent.] and a solvent.

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Masahisa Endo
Kazuhiro Sawada
Takahiro Kishioka

JP2022508378A

March 06, 2024

March 16, 2021

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Nissan Chemical Co., Ltd.

G03F7/038; C08G65/40; G03F7/027; G03F7/20

WO2019044874A1

Patent Attorney Corporation Tsukuni

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