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Title:
PHOTOSENSITIVE MATERIAL PACKAGED BODY
Document Type and Number:
Japanese Patent JP2002174880
Kind Code:
A
Abstract:

To provide a photosensitive material packaged body using a molding which does not adversely affect a photographic sensitive material, particularly a high sensitivity film.

In the photosensitive material packaged body obtained by disposing a silver halide color photographic sensitive material having one or more red-sensitive silver halide emulsion layers, one or more green-sensitive silver halide emulsion layers and one or more blue-sensitive silver halide emulsion layers on the base and a plastic material member using a regenerated thermoplastic resin in a common vapor atmosphere and sealing up the sensitive material, ≥60% of the total projected area of silver halide grains contained in one or more of the sensitive emulsion layers is occupied by flat platy grains having an aspect ratio of ≥8.0 and the plastic material member is produced with a resin to which a substance adsorbing substances having harmful effects on photographic properties has been added before molding.


Inventors:
MATSUMOTO KEISUKE
YOKOTA KOICHI
NISHIMURA RYOJI
MIKOSHIBA TAKASHI
KAMATA MITSUO
Application Number:
JP2001104710A
Publication Date:
June 21, 2002
Filing Date:
April 03, 2001
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
C08K5/00; C08L101/00; G03B27/46; G03C3/00; G03D13/00; G03C1/035; G03C1/005; G03C7/30; (IPC1-7): G03C3/00; C08K5/00; C08L101/00; G03B27/46; G03C1/035; G03D13/00
Attorney, Agent or Firm:
Takehiko Suzue (5 outside)