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Title:
PHOTOSENSITIVE POLYMER, CHEMICAL AMPLIFICATION TYPE RESIST COMPOSITION CONTAINING SAME AND METHOD FOR PRODUCING SAME
Document Type and Number:
Japanese Patent JP3706805
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a photosensitive polymer, a resist composition containing the polymer and a method for producing the polymer.
SOLUTION: The photosensitive polymer is represented by formula I (where R1 is an acid decomposable tertiary alkyl; R2 is γ-butyrolacton-1, γ- butyrolacton-3-yl, mevalonic lactone, 3-tetrahydrofuranyl, 2, 3-propylene carbonate-1-yl or 3-methyl-γ-butyrolacton-3-yl; R3 is H, methyl, ethyl or a 3-20C alicyclic hydrocarbon compound; p/(p+q+r)=0.1 to 0.8; q/(p+q+r)=0.2 to 0.8; and r/(p+q+r)=0.0 to 0.4).


Inventors:
Kim, Hyun-woo
Shikei RI.
Kwon, Ki-young
Dong-won, Jung
Sang-jun, Choi
Woo, Sang-gyun
Application Number:
JP2000000374769
Publication Date:
October 19, 2005
Filing Date:
December 08, 2000
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
C08F2/04; C08F232/00; C08K5/00; C08L45/00; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): C08F232/00; C08F2/04; C08K5/00; C08L45/00; G03F7/039; H01L21/027
Domestic Patent References:
JP11184091A
JP10111569A
JP10207058A
JP2000292926A
JP2001194786A
Attorney, Agent or Firm:
八田 幹雄
野上 敦
奈良 泰男
齋藤 悦子
宇谷 勝幸