To provide a photosensitive polymer composition good in plamarizability of wiring step difference and embeddability of fine grooved- patterns, and capable of easily obtaining a polyimide film possible to form patterns by the publicly known processing of a photosensitive polymer composition.

By adding a monohydric alcohol of 2.0-4.0 mol, having C4 or below, to an aromatic tetrabasic acid dianhydride of 1 mol, and heating, a part or all of the tetrabasic acid dianhydride is converted to diester. Thereafter, an amine compound of 0.1-0.8 mol shown by general formula I, an amine compound of 0.1-0.8 mol shown by general formula II, and another diamine compound of 0-0.8 mol are reacted with the above diester wherein a total quantity of amine compounds is 0.9-1.1 mol. The photosensitive polymer composition is composed of a polyimide resin precursor obtained by the above reaction of 100 pts.wt. and a monoazide acid compound of 0.1-100 pts.wt. (In formula, R1 is an aromartic ring group, R2 is hydrogen or a methyl group, n is 1-3, R3 is hydrogen or a hydrocarbon group of C3 or below, and R3 may be different).