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Title:
PHOTOSENSITIVE POLYMER HAVING FLUORINATED ETHYLENE GLYCOL GROUP AND CHEMICALLY AMPLIFIED RESIST COMPOSITION COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2008163347
Kind Code:
A
Abstract:

To provide a photosensitive polymer which improves characteristics of a resist such as a high transmittance and good dry etching resistance and which can form a fine pattern.

The photosensitive polymer having the structural formula can solve the above problem, wherein R1 is a hydrogen atom or a methyl group, R2 is a 3-10C hydrocarbon group having a fluorinated ethylene glycol group, R5 is a hydrogen atom, hydroxy group, 1-10C hydrocarbon group, or 1-10C fluorinated hydrocarbon group, and m/(m+o)=0.1-0.6, and o/(m+o)=0.4-0.9.


Inventors:
Sang-jun, Choi
Moon, Ju-tae
Woo, Sang-gyun
Yoon, Kwang-sub
Song, Ki-yong
Application Number:
JP2008000050068
Publication Date:
July 17, 2008
Filing Date:
February 29, 2008
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
C08F212/14; C08F20/26; C08F220/10; C08F220/26; C08F220/42; C08F232/04; G03F7/004; G03F7/039; H01L21/027
Domestic Patent References:
JPH0558068A1993-03-09
JP2001048943A2001-02-20
Attorney, Agent or Firm:
八田 幹雄
奈良 泰男
宇谷 勝幸