To provide a positive type photosensitive resin composition which has excellent heat resistance and transparency.
The photosensitive resin composition contains a resin component (A1) which has a structural unit, expressed by a formula (a1'), based on a structural unit expressed by a formula (a1), of which at least a part of hydrogen atoms of phenolic hydroxyl groups is substituted with a naphthoquinone-1,2-diazide-5- (and/or -4-) sulfonyl group. In the formula, R0 represents a hydrogen atom or a methyl group, R1 represents a single bond or a 1-5C alkylene group, R2 represents a 1-5C alkyl group, a represents an integer of 1-5, b represents 0 or an integer of 1-4, and a+b is 5 or less. In addition, in the case two or more R2 exist, these R2 are optionally different from one another or identical.
SUGIMOTO YASUAKI
TATENO ISAO
SHINODA MASARU
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai