Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY COMPONENT AND DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2023180018
Kind Code:
A
Abstract:
To provide a photosensitive resin composition that can yield a cured film with high light-blocking performance and low reflectance, as well as low brightness.SOLUTION: A photosensitive resin composition includes (A) a resin component that includes an unsaturated group-containing alkali-soluble resin (A1), a photopolymerizable compound with at least two unsaturated bonds (A2), and a thermosetting epoxy compound (A3), (B) a light blocking component including a black pigment (B1) and magnesium fluoride and/or cryolite fine particles (B2), and (C) a photopolymerization initiator.SELECTED DRAWING: None
Inventors:
IWAI KOHEI
ONO YUKI
ONO YUKI
Application Number:
JP2022093056A
Publication Date:
December 20, 2023
Filing Date:
June 08, 2022
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
G03F7/004; G03F7/027; G09F9/00; G09F9/30; H05B33/02; H05B33/22; H10K59/10
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office