Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR DEEP UV LIGHT
Document Type and Number:
Japanese Patent JPH0396951
Kind Code:
A
Abstract:
PURPOSE: To lessen the absorption of deep UV light and to provide sufficient drying etching resistance an high sensitivity by using a compsn. consisting of polyvinyl biphenyl and specific azide compd.
CONSTITUTION: This compsn. consists of the polyvinyl biphenyl (A) and the azide compd. (B) having two azide groups in one heterocyclic arom. ring. The component A of a desired mol. wt. and the component B, such as 2, 4-diazide pyrimidine, etc., are dissolved in ethylene glycol monomethyl ether acetate, etc., and this soln. is applied on a silicone wafer or the like to form a resist film. The film is exposed with the deep UV light and is developed to form patterns; thereafter, the film is etched dry.
Inventors:
YOSHIDA YASUHIRO
FUJIOKA HIROFUMI
NAKAJIMA HIROYUKI
FUJIOKA HIROFUMI
NAKAJIMA HIROYUKI
Application Number:
JP23347289A
Publication Date:
April 22, 1991
Filing Date:
September 09, 1989
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G03F7/008; C08F12/00; C08F12/24; C08L25/00; H01L21/027; (IPC1-7): C08F12/24; C08L25/00; G03F7/008; H01L21/027
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Next Patent: JPH0396952