PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST

Title:

PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST

Document Type and Number:

Japanese Patent JP2007114234

Kind Code:

A

Abstract:

To provide a photosensitive resin composition having high resolution, high adhesion and excellent tent film reliability, and a photosensitive dry film resist obtained using the same.

The photosensitive resin composition contains a carboxylic polymer (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C), wherein the ethylenically unsaturated compound (B) contains at least a compound (B1) represented by formula (1).

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Inventors:

YAMAMOTO HISATOSHI
HAMADA YASUHIRO
MURAKAMI SHIGERU
HIUGA ATSUYOSHI

Application Number:

JP2005302418A

Publication Date:

May 10, 2007

Filing Date:

October 18, 2005

Export Citation:

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Assignee:

NICHIGO MORTON CO LTD

International Classes:

G03F7/027; C08F290/06; G03F7/004; G03F7/11; H05K3/00

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