PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD

Japanese Patent JP2017191204

A

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high photosensitivity and also excellent resolution even when containing a carboxyl group-containing resin with a bisphenol fluorene skeleton.SOLUTION: A photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B), a photopolymerization initiator (C), and an epoxy compound (D). The carboxyl group-containing resin (A) contains a carboxyl group-containing resin (A1) that is a reactant of: an intermediate that is a reactant of an epoxy compound (a1) and an unsaturated group-containing carboxylic acid (a2); and an acid anhydride. The epoxy compound (a1) has a bisphenol fluorene skeleton. The photopolymerization initiator (C) contains an oxime ester photopolymerization initiator (C1), and the amount of the oxime ester photopolymerization initiator (C1) is 0.05-60 mass% relative to the total amount of the photopolymerization initiator (C).SELECTED DRAWING: Figure 1

WO/2001/004705	ALKALI DEVELOPMENT TYPE PHOTOCURABLE COMPOSITION AND PATTERN OF BURNED MATTER OBTAINED FROM THE SAME
WO/2020/195962	COLORED CURABLE RESIN COMPOSITION, COLOR FILTER AND SOLID-STATE IMAGING ELEMENT
JPH10246954	PHOTOPOLYMERIZABLE COMPOSITION

HIGUCHI MICHIYA
HASHIMOTO SOICHI
ARAI TAKASHI
KAWASATO HIRONOBU
INABA SHINJI

JP2016080338A

October 19, 2017

April 13, 2016

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GOO CHEMICAL CO LTD
NIPPON STEEL & SUMIKIN CHEM CO

G03F7/027; C08G59/18; G03F7/004; G03F7/029; G03F7/031; H05K1/03; H05K3/06; H05K3/18; H05K3/28

Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura

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