Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2014232232
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of improving chemical resistance of a cured film, and to provide an electronic device.SOLUTION: The photosensitive resin composition comprises a polymer expressed by formula (1), a crosslinking agent that crosslinks with the polymer, a surfactant having a crosslinking group, and a photosensitizer. In formula (1), l and m represent molar content percentages in the polymer and satisfy l+m=1; n is 0, 1, or 2; R, R, Rand Reach independently represent hydrogen or an organic group having 1 to 30 carbon atoms; and A represents a maleic acid compound unit.
Inventors:
IKEDA TAKAO
ONISHI OSAMU
IMAMURA YUJI
TAGASHIRA NOBUO
ONISHI OSAMU
IMAMURA YUJI
TAGASHIRA NOBUO
Application Number:
JP2013113408A
Publication Date:
December 11, 2014
Filing Date:
May 29, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/023; C08F8/00; C08F222/06; C08F232/00; G02F1/1333; G03F7/004; H01L21/027
Domestic Patent References:
| JP2006100563A | 2006-04-13 | |||
| JP2004190008A | 2004-07-08 | |||
| JP2000231191A | 2000-08-22 | |||
| JP2008518276A | 2008-05-29 | |||
| JP2003202672A | 2003-07-18 | |||
| JPH11160877A | 1999-06-18 | |||
| JP2010062124A | 2010-03-18 | |||
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Foreign References:
| WO2011105443A1 | 2011-09-01 |
Attorney, Agent or Firm:
Shinji Hayami
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