Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2015184325
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition having an excellent balance between stability with time and mechanical characteristics of a cured film.SOLUTION: The photosensitive resin composition is used for forming a permanent film and comprises an alkali-soluble resin and a photosensitive agent. A varnish prepared by dissolving the photosensitive resin composition in an organic solvent to have a 30% solid content exhibits the following properties: an initial viscosity ηof the varnish at 25°C before storage and a viscosity ηat 25°C after stored at 40±1°C for 7 days satisfy that η/ηis 3.0 or less; and in a DSC curve obtained by use of a differential scanning calorimeter by heating from 30 to 300 under a temperature elevation rate of 10°C/min after the varnish is irradiated with g+h+i lines at a luminous energy of 300 mJ/cm, a peak temperature Tin a maximum exothermic peak is 185°C or lower.
Inventors:
ONISHI OSAMU
Application Number:
JP2014058128A
Publication Date:
October 22, 2015
Filing Date:
March 20, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/004; C08F232/00; G03F7/023; H01L21/027
Domestic Patent References:
| JP2013242348A | 2013-12-05 | |||
| JP2001343748A | 2001-12-14 | |||
| JP2013152375A | 2013-08-08 | |||
| JP2007279493A | 2007-10-25 | |||
| JP2003313177A | 2003-11-06 | |||
| JP2003238624A | 2003-08-27 | |||
| JP2012008537A | 2012-01-12 |
Foreign References:
| WO2013172435A1 | 2013-11-21 | |||
| WO2011136074A1 | 2011-11-03 | |||
| WO2012026465A1 | 2012-03-01 | |||
| WO2009041681A1 | 2009-04-02 | |||
| WO2013171888A1 | 2013-11-21 |
Attorney, Agent or Firm:
Shinji Hayami
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