PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Japanese Patent JP2018031799

A

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which forms a cured film particularly excellent in tent reliability.SOLUTION: The photosensitive resin composition contains a component (A): a binder polymer, a component (B): a photopolymerizable compound, and a component (C): a photopolymerization initiator and also contains a component (D): a compound having at least two or more of polyethylene oxide [-(CHO)-], polypropylene oxide [-(CHO)-], and polytetramethylene oxide [-(CHO)-] (k, l and m are each 1 or more, and k+l+m is 20 or more) as structural units in an amount of 2-20 mass% based on the total solid content of the photosensitive resin composition.SELECTED DRAWING: Figure 1

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FUJII TETSUFUMI
KIMURA HISAHIRO
KAJIWARA TAKUYA

JP2014264400A

March 01, 2018

December 26, 2014

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HITACHI CHEMICAL CO LTD

G03F7/004; C08F12/02; C08F20/10; G03F7/033; H05K3/06; H05K3/18

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