To provide a photosensitive resin composition having a sufficient effect on improvement of resolution and resist removing property, a photosensitive element, a resist pattern forming method, and a method for manufacturing printed wiring board.

The photosensitive resin composition comprises: (A-1) a binder polymer having a specific structure; (A-2) polyvinyl acetate (having a weight average molecular weight of 10,000-200,000 in terms of polystyrene); (B) a photopolymerizable compound; and (C) a photosensitive resin composition including a photopolymerization initiator.