Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2002182386
Kind Code:
A
Abstract:
To provide a photosensitive resin composition excellent in resolution, adhesion, sensitivity, plating bath contaminating property and product stability.
In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a single molecule and (C) a photopolymerization initiator, a compound of formula (I) and a tris(dimethylaminomethyl)phenol derivative are contained as the component (C) by ≥0.005 pt.wt. based on 100 pts.wt., in total, of the components (A) and (B).
Inventors:
ITAGAKI KATSUTOSHI
OTOMO SATOSHI
KAJIWARA TAKUYA
ABE TAKUJI
OTOMO SATOSHI
KAJIWARA TAKUYA
ABE TAKUJI
Application Number:
JP2000380539A
Publication Date:
June 26, 2002
Filing Date:
December 14, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/031; C08F2/44; C08F2/50; C08F257/00; G03F7/004; G03F7/027; G03F7/033; H05K3/06; H05K3/18; (IPC1-7): G03F7/031; C08F2/44; C08F2/50; C08F257/00; G03F7/004; G03F7/027; G03F7/033; H05K3/06; H05K3/18