Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR FABRICATING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2011145517
Kind Code:
A
Abstract:
To provide a photosensitive resin composition excellent in strippability of a resist thereof and capable of improving adhesion and resolution; and to provide a photosensitive element using the same, a method for fabricating a resist pattern and a method for manufacturing a printed wiring board.
The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond, and (C) a photoinitiator comprising an acridine compound, wherein the photopolymerizable compound (B) contains a diacrylate compound with hydrogenated bisphenol as the mother nucleus.
Inventors:
ISO JUNICHI
AJIOKA YOSHIKI
ISHI MITSURU
USUBA AIMI
AJIOKA YOSHIKI
ISHI MITSURU
USUBA AIMI
Application Number:
JP2010006809A
Publication Date:
July 28, 2011
Filing Date:
January 15, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/031; C08F2/44; C08F2/50; C08F265/06; G03F7/027; H05K3/06; H05K3/18
Domestic Patent References:
| JP2008287227A | 2008-11-27 | |||
| JP2004341354A | 2004-12-02 |