PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, DEVICE AND METHOD FOR FORMING RESIST PATTERN

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, DEVICE AND METHOD FOR FORMING RESIST PATTERN

Document Type and Number:

Japanese Patent JP2023052059

Kind Code:

A

Abstract:

To provide a photosensitive resin composition that can form a resist pattern having excellent resolution and HAST resistance, even with respect to a photosensitive layer having a thickness of more than 20 μm.SOLUTION: A photosensitive resin composition of the invention contains (A) a polyfunctional phenol novolac type epoxy resin, (B) a photosensitive acid generator containing an onium gallate salt, and (C) a sensitizer.SELECTED DRAWING: None

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Inventors:

Kenichi Iwashita
Tetsuya Kato
Tetsuya Yoshida
Yokochi Seigo

Application Number:

JP2022206716A

Publication Date:

April 11, 2023

Filing Date:

December 23, 2022

Export Citation:

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Assignee:

Resonac Co., Ltd.

International Classes:

G03F7/038; C08G59/08; C08G59/32; C08G59/68; G03F7/004; G03F7/20; H05K3/28

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Mayumi Shinoda

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