To provide a photosensitive resin composition having excellent moist-heat resistance and showing, in a cured product of the composition, a high elastic modulus at a high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib pattern, a method for forming a hollow structure, and electronic components using the composition.

The photosensitive resin composition to be used as a rib material or a cap material for forming a hollow structure in an electronic component having the hollow structure contains inorganic filler having an average aspect ratio of 30 to 100, preferably over 50 and 100 or less, and having a volume average particle diameter of 5 to 50 μm. The photosensitive film is obtained from the photosensitive resin composition.