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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2006053484
Kind Code:
A
Abstract:

To provide a photosensitive resin composition forming a photosensitive film layer which adequately excels in sandblasting resistance at the time of sandblasting processing, particularly under the high pressure condition when forming a concavo-convex pattern on the surface of a base material using sandblasting.

The photosensitive resin composition comprises (A) a binder component containing a polymer having (meta) acrylic acid and/or (meta) acrylic acid ester as a monomer unit, (B) a photopolymerizable compound having a polymerizable ethylene unsaturated group, (C) a photopolymerization initiator, and (D) a plasticizer having a phosphorus atom in its molecule.


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Inventors:
HATANO TAKESHI
NAKANO AKIO
KAZAMA HIROKO
Application Number:
JP2004236730A
Publication Date:
February 23, 2006
Filing Date:
August 16, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/004; C08F290/06; G03F7/027; G03F7/033
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Ryugo Akahori



 
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