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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND RESIN FILM
Document Type and Number:
Japanese Patent JP2018185480
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition useful for preparing an electronic device having a resin film which is excellent in a balance among corrosion resistance, patterning properties, preservability and chemical resistance, and can maintain an appearance even when a pressure cooker test is performed.SOLUTION: A photosensitive resin composition contains an alkali-soluble resin, a photoacid generator, a thermal acid generator, and a thermal crosslinking agent, where the thermal acid generator is an aromatic sulfonium salt, and has a pH measured on the following condition of 1.3 or more and 3.5 or less (condition: crushing a cured product obtained by curing the photosensitive resin composition on conditions of 230°C and 30 minutes in a mortar to obtain a crushed product, then placing the crushed product in ultrapure water of 5 times volume of the crushed product, and measuring a pH of a hot water extract obtained by heating the ultrapure water at 125°C for 20 hours).SELECTED DRAWING: None

Inventors:
大谷 祥一朗
川浪 卓士
池田 拓司
Application Number:
JP2017088626A
Publication Date:
November 22, 2018
Filing Date:
April 27, 2017
Export Citation:
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Assignee:
住友ベークライト株式会社
International Classes:
G03F7/023; C08G73/22; G03F7/004
Attorney, Agent or Firm:
速水 進治