To provide a photosensitive resin composition having good adhesiveness to a substrate or a base, having high film hardness, heat resistance and acid resistance, and having high transmittance, particularly high transmittance at a wavelength near 400 nm, and to provide an insulating film for a touch panel using the resin composition.

A photosensitive resin composition contains a resin (A), a photopolymerization initiator (B) and a multifunctional monomer (C). The resin (A) contains a resin (A1) prepared by copolymerizing a compound (a1) represented by general formula (1) and another compound (a2) copolymerizable with the compound (a1). The multifunctional monomer (C) includes 7 or more ethylenically unsaturated bonds in a molecule.