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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ITS CURED PRODUCT
Document Type and Number:
Japanese Patent JP2008074938
Kind Code:
A
Abstract:

To provide a photosensitive resin composition having excellent optical sensitivity and giving a cured product having excellent adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, etc.

The invention provides (A) a resin containing an unsaturated group and obtained by reacting (a) an epoxy compound having 2 glycidyl groups in the molecule with (b) a saturated monocarboxylic acid compound having an alcoholic hydroxyl group and reacting the hydroxyl group of the obtained epoxy carboxylate resin with (c) a monoisocyanate compound having ethylenic unsaturated group, (A') a resin containing an acid-modified unsaturated group and obtained by reacting the hydroxyl group of the unsaturated group-containing resin A with (d) a polybasic acid anhydride, and a photosensitive resin composition containing the above resin, and (B) a photopolymerization initiator and (C) a reactive crosslinking agent.


Inventors:
YAMAMOTO KAZUYOSHI
KURIHASHI TORU
KOYANAGI TAKAO
Application Number:
JP2006255121A
Publication Date:
April 03, 2008
Filing Date:
September 21, 2006
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/14; C08F290/14; G03F7/027; H01L21/027