Title:
感光性樹脂組成物、その硬化皮膜およびプリント配線板
Document Type and Number:
Japanese Patent JP5875821
Kind Code:
B2
Abstract:
[Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition comprises (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin and is characterized by comprising (C) an aluminum-containing inorganic filler in an amount of not less than 200 parts by mass with respect to 100 parts by mass of total carboxylic acid resins.
Inventors:
Akio Norikoshi
Seio Arima
Seio Arima
Application Number:
JP2011218749A
Publication Date:
March 02, 2016
Filing Date:
September 30, 2011
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/004; C08K3/00; C08L63/00; C08L101/08; G03F7/032; H05K3/28
Domestic Patent References:
| JP2011164305A | ||||
| JP2010181825A | ||||
| JP2011164270A | ||||
| JP2010181647A | ||||
| JP2010282003A |
Foreign References:
| WO2006106892A1 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Atsushi Shinoda
Watari Takumi
Yumiko Sugimoto
Atsushi Shinoda
Watari Takumi