Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ITS HARDENED PRODUCT AND IMAGE FORMING MATERIAL
Document Type and Number:
Japanese Patent JP3287661
Kind Code:
B2
Abstract:
PURPOSE: To reduce hardening shrinkage and to enhance hardness, heat resistance to soldering, transparency, adhesiveness, resistances to acid, alkali, and solvents, and insulation resistance by adding a specified spiro-orthoester to the constituent elements of the composition.
CONSTITUTION: This photosensitive resin composition contains 100 pts.wt. of a photopolymerizable compound having an ethylenically unsaturated double bond and a carboxylic group, 0.1-10 pts.wt. of a photopolymerization initiator to be allowed to generate a radical, and 5-100 pts.wt. of the spiro-orthoester compound having in the molecule ≥2 spiro-orthoester groups represented by the formula in which p is an integer of 3-5. The spiro-orthoester to be used for the composition is prepared by reaction of a lactone, such as γ-butyrolactone, δ-valerolactone, or ε-caprolactone, with an epoxy resin.
Inventors:
Koichi Fujishiro
Kazuhiro Watanabe
Masaya Furukawa
Takeo Teramoto
Kazuhiro Watanabe
Masaya Furukawa
Takeo Teramoto
Application Number:
JP21429393A
Publication Date:
June 04, 2002
Filing Date:
August 30, 1993
Export Citation:
Assignee:
Nippon Steel Corporation
Nippon Steel Chemical Co., Ltd.
Nippon Steel Chemical Co., Ltd.
International Classes:
G02B5/20; G03F7/004; G03F7/027; G03F7/028; G03F7/038; G06F3/041; (IPC1-7): G03F7/004; G02B5/20; G03F7/027; G03F7/028; G03F7/038; G06F3/033
Domestic Patent References:
| JP2116851A | ||||
| JP570528A | ||||
| JP4355450A | ||||
| JP56167717A |
Attorney, Agent or Firm:
Katsuo Naruse (1 person outside)