Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION LAYER AND PHOTORESIST FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2006178082
Kind Code:
A
Abstract:
To provide a photosensitive resin composition, a photosensitive resin composition layer and a photoresist film excellent in flexibility and reliability of tent film strength even in the case of a small resist film thickness and excellent also in resolution.
The photosensitive resin composition contains a binder polymer (A), an ethylenically unsaturated compound (B), a photopolymerization initiator (C) and a compound (D) represented by formula (1) wherein m and n are each 0 or 1 but both of them are not 0; X and Y are each a 1-4C alkyl, alkoxyl, halogen, hydroxyl, mercapto or amino and may be the same or different; a dimer may be formed through at least one of X and Y; and R is a 1-12C alkyl.
Inventors:
HAMADA YASUHIRO
TAKAMIYA HIROYUKI
HIUGA ATSUYOSHI
TAKAMIYA HIROYUKI
HIUGA ATSUYOSHI
Application Number:
JP2004369709A
Publication Date:
July 06, 2006
Filing Date:
December 21, 2004
Export Citation:
Assignee:
NICHIGO MORTON CO LTD
International Classes:
G03F7/004; C08F2/44; C08F265/04; G03F7/033; H05K3/00