To provide a photosensitive resin composition and a photosensitive resin layered body having characteristics of high resolution, high adhesiveness, favorable dispersion stability in a developing solution, and excellent tenting property and plating property.

The photosensitive resin composition which contains the following is prepared; (a) a binder resin comprising a linear polymer having 100 to 600 carboxyl group content in terms of acid equivalent and having 20,000 to 500,000 weight average molecular weight; (b) a photopolymerizable unsaturated compound containing a branched alkyl group and at least an ethyleneglycol chain; and (c) a photopolymerization initiator. The obtained photosensitive resin composition is used to manufacture a printed wiring board, a lead frame, a semiconductor package or the like.