Title:
PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF PHOTOSENSITIVE ELEMENT AND PLATING RESIST USING THAT
Document Type and Number:
Japanese Patent JP3125424
Kind Code:
B2
Abstract:
PURPOSE: To provide a photosensitive resin compsn. with which a photosensitive element and a resist having both alkali developing property and resistance to electroless copper plating and having excellent flexibility can be obtd.
CONSTITUTION: This photosensitive resin compsn. consists of a polyhydroxyether resin compd., acid anhydride-modified epoxyacrylate compd., photopolymerizable unsatd. compd. containing two or more end ethylene groups, and photopolymn. initiator. The polyhydroxyether resin compd. is obtd. by adding ethylene oxide or propylene oxide to hydroxyl groups of a polyhydroxyether resin compd. having a unit expressed by formula, then effecting the reaction with basic acid anhydride, and allowing the product to react with (meth)acrylic acid glycidyl ester. The photosensitive element and the plating resist are produced by using this resin compsn. In formula, R2 and R3 are alkyl groups, alkoxy groups or halogens, and x and y are independently integers 0-4.
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Inventors:
Fumihiko Ohta
Toshiaki Ishimaru
Akio Nakano
Shinji Tsuchikawa
Toshiaki Ishimaru
Akio Nakano
Shinji Tsuchikawa
Application Number:
JP8256992A
Publication Date:
January 15, 2001
Filing Date:
April 06, 1992
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08F299/02; C08F290/00; G03F7/027; G03F7/028; G03F7/032; G03F7/038; H01L21/027; H05K3/06; (IPC1-7): G03F7/038; C08F299/02; G03F7/027; G03F7/028; H05K3/06
Domestic Patent References:
| JP59149353A | ||||
| JP425846A | ||||
| JP6420273A |
Attorney, Agent or Firm:
Kunihiko Wakabayashi