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Title:
Photosensitive resin composition, manufacturing method of cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel
Document Type and Number:
Japanese Patent JP6349335
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in heat-resistant transparency and patterning property, and a production method of a cured film and a cured film, a liquid crystal display device, an organic electroluminescence display device and a touch panel each using the above composition.SOLUTION: The photosensitive resin composition comprises a polybenzoxazole precursor, a photoacid generator that generates an acid having a pKa of 3 or less, a heat base generator, and a solvent. The polybenzoxazole precursor has a phenolic hydroxyl group at least partially protected by an acid decomposable group. The heat base generator is a compound represented by formula (X) below. In formula (X), m represents an integer of 1 to 4; R, Rand Reach independently represent an alkyl group having 1 to 5 carbon atoms; Rrepresents an m-valent organic group which may have a hetero atom; and when m is 2 to 4, a plurality of R, R, and Reach may be the same or different.SELECTED DRAWING: None

Inventors:
Mikio Nakagawa
Hiroyuki Yonezawa
Tomoda Matsuda
Satoru Yamada
Application Number:
JP2016037039A
Publication Date:
June 27, 2018
Filing Date:
February 29, 2016
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08G73/22; G02F1/1333; G03F7/004; G03F7/40; H01L51/50; H05B33/22
Domestic Patent References:
JP2004077551A
JP2013152381A
JP2012123378A
JP2007094317A
JP2008026673A
JP2002526793A
JP2011512552A
JP2010211109A
Foreign References:
WO2013141376A1
WO2007004345A1
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi