Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURABLE RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022109277
Kind Code:
A
Abstract:
To provide: a photosensitive resin composition with which good resolution is exhibited even when displacement occurs in a focus depth, good resolution is exhibited regardless of a base material, and good chemical resistance is achieved; a method for forming a curable relief pattern using the photosensitive resin composition; and a semiconductor device having the curable relief pattern.SOLUTION: A photosensitive resin composition contains following components: (A) a polyimide precursor in which i-ray absorbance of a 0.1 wt.% N-methylpyrrolidone solution is 0.1-0.6; and (B) a photopolymerization initiator having a carbazole structure.SELECTED DRAWING: None
Inventors:
FUJIWARA AKIRA
SHIMIZU KENJU
SAKATA ISAO
SHIMIZU KENJU
SAKATA ISAO
Application Number:
JP2022071923A
Publication Date:
July 27, 2022
Filing Date:
April 25, 2022
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
G03F7/027; C08G73/10; C08L79/08; G03F7/004; G03F7/031; G03F7/20
Domestic Patent References:
| JP2016167036A | 2016-09-15 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
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