Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2023155261
Kind Code:
A
Abstract:
To provide a photosensitive resin composition capable of manufacturing a highly reliable electronic device by heating and curing the composition at approximately 170°C to form a cured film.SOLUTION: There is provided a photosensitive resin composition which comprises a polyamide resin and/or a polyimide resin, wherein a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours has a storage elastic modulus E'220 at 220°C of 0.5 to 3.0 GPa by measuring dynamic viscoelasticity under the following conditions. [Conditions] Frequency: 1 Hz, Temperature: 30 to 300°C, Temperature rising rate: 5°C/min, Measurement mode: Tensile mode.SELECTED DRAWING: Figure 1
Inventors:
KAWANAMI TAKUSHI
TANAKA YUMA
KAWASAKI RITSUYA
TANAKA YUMA
KAWASAKI RITSUYA
Application Number:
JP2023127695A
Publication Date:
October 20, 2023
Filing Date:
August 04, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G73/10; G03F7/40; G03F7/037; G03F7/20; G03F7/26
Attorney, Agent or Firm:
Shinji Hayami