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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME, AND, USE OF THE SAME
Document Type and Number:
Japanese Patent JP2019147855
Kind Code:
A
Abstract:
To provide photosensitive resin composition low in a swelling rate and an elution rate to water, and excellent in water resistance.SOLUTION: A photosensitive resin composition (D) is provided that contains: modified polyvinyl alcohol (A) having a double bond derived from unsaturated carboxylic acid or a derivative thereof; a photopolymerization initiator (B); and a compound (C), where the compound (C) is at least one compound selected from the group consisting of a compound having a conjugated double bond, and having two or more hydroxyl groups bonded to carbon atoms constituting the conjugated double bond, or a salt thereof, a cyclic nitroxyl radical (C2) and oxide thereof (C1) and alkoxy phenol (c3), where the viscosity average polymerization degree of the modified polyvinyl alcohol (A) is 200 or more and 4,500 or less,and where the saponification degree is 65 mol% or more and 99.9 mol% or less, and the 1,2-glycol bonding amount is 1.4 mol% or more and 1.9 mol% or less.SELECTED DRAWING: None

Inventors:
KABARU TAEKO
MORIKAWA KEISUKE
FUKUHARA TADAHITO
AMANO YUSUKE
TACHIBANA YUKI
Application Number:
JP2018031714A
Publication Date:
September 05, 2019
Filing Date:
February 26, 2018
Export Citation:
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Assignee:
KURARAY CO
International Classes:
C08F299/00; B41M5/337; B41M5/44; C08F8/14; C08F216/06; C09D7/63; C09D129/04
Domestic Patent References:
JP2010208307A2010-09-24
JPS63202681A1988-08-22
JP2005298697A2005-10-27
JP2004091774A2004-03-25
JP2004143309A2004-05-20
JPH08134137A1996-05-28
JPH0672023A1994-03-15
JPS5632138A1981-04-01
JPH08156424A1996-06-18
JP2001113646A2001-04-24
JP2000309607A2000-11-07
Foreign References:
US5340693A1994-08-23
WO2014192931A12014-12-04