Title:
感光性樹脂組成物および電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7338142
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition allowing pattern formation through photographic exposure and development, the composition satisfying both of: sufficiently strong adhesion of a pattern even after heating the pattern to decompose a remaining photosensitizer; and reduction in the amount of outgas generated after the pattern is subjected to adhesion.SOLUTION: The photosensitive resin composition comprises an alkali-soluble resin, a photosensitizer, and a compound represented by the following general formula (1). In the general formula (1), n is equal to or greater than 2; multiple Rare each independently a C2-8 linear or branched alkylene group; multiple X are each independently selected from the group consisting of a carbonate group (-O-(C=O)-O-), an ester group (-COO- or -OCO-) and an ether group (-O-); and Ris a C2-8 linear or branched alkylene group.SELECTED DRAWING: Figure 1
Inventors:
Yudai Yamakawa
Yuma Tanaka
Yasunori Takahashi
Yuma Tanaka
Yasunori Takahashi
Application Number:
JP2018203419A
Publication Date:
September 05, 2023
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/004; G03F7/023; G03F7/20; G03F7/40; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016086073A |
Foreign References:
| WO2013085004A1 | ||||
| WO2009125752A1 |
Attorney, Agent or Firm:
Shinji Hayami