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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, ELECTRONIC DEVICE PRODUCTION METHOD, POLYMER, AND POLYMER PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2019045622
Kind Code:
A
Abstract:
To provide a photosensitive resin composition which has a good film-remaining property and reduces crack generation.SOLUTION: A specific polymer comprising a structural unit represented by a general formula (1) (specifically, N-(4-hydroxyphenyl) maleimide or the like), and a structural unit represented by a general formula (2) (specifically, 2-norbornene or the like) is used to prepare a photosensitive resin composition. Preferably, the specific polymer further comprises a structural unit represented by a chemical formula (3) (specifically, maleimide), and a structural unit represented by a chemical formula (4) (specifically, N-phenylmaleimide).SELECTED DRAWING: None

Inventors:
池田 陽雄
大西 治
Application Number:
JP2017167157A
Publication Date:
March 22, 2019
Filing Date:
August 31, 2017
Export Citation:
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Assignee:
住友ベークライト株式会社
International Classes:
G03F7/023; C08F222/40; C08F232/08
Attorney, Agent or Firm:
速水 進治