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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTO-CURED PATTERN PRODUCED FROM THE SAME
Document Type and Number:
Japanese Patent JP2018045239
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition in which chemical resistance to a solvent and developability are simultaneously improved, and a photo-cured pattern produced from the composition.SOLUTION: The present invention relates to a photosensitive resin composition and a photo-cured pattern produced from the composition. More particularly, the present invention relates to a photosensitive resin composition in which chemical resistance to a solvent and developability are simultaneously improved, by incorporating an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator and a solvent, where the polymerizable compound comprises a compound represented by chemical formula 1 and a compound represented by chemical formula 2; and to a photo-cured pattern produced from the above composition.SELECTED DRAWING: Figure 2a

Inventors:
AHN BO-EUN
KIM SEONG BEEN
CHUN JI MIN
Application Number:
JP2017175483A
Publication Date:
March 22, 2018
Filing Date:
September 13, 2017
Export Citation:
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Assignee:
DONGWOO FINE-CHEM CO LTD
International Classes:
G03F7/027; C08G59/68; G02F1/1333; G02F1/1335; G02F1/1339; G03F7/038
Attorney, Agent or Firm:
江部 武史
朝比 一夫